Waterblock v1
Fluid Heat Exchanger for SiC MOSFETs, 2022/23
Fluid Heat Exchanger for SiC MOSFETs, 2022/23
101 g //
LxWxH 70x64x32 //
Max. Dissipation 150 W //
Aluminium Base //
EPDM Gasket //
PA12 Lid //
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LxWxH 70x64x32 //
Max. Dissipation 150 W //
Aluminium Base //
EPDM Gasket //
PA12 Lid //
Read More
In 2022/23, I developed a thermal management solution for use in vacuum transport prototypes as my bachelor’s thesis at ETH Zurich. Waterblock v1 was designed in conjunction with VCM v1 for use in Swissloop prototype Bertrand Piccard.
In July 2023, VCM v1 and Waterblock v1 won the Best Thermal Management award at the European Hyperloop Week in Edinburgh, United Kingdom.
To carry heat effectively from 17 large MOSFETs in Bertrand Piccard’s power electronics, Waterblock v1 is designed with the trade-off of heat transfer and pressure loss in mind. The fins in the base enhance heat transfer, and were manufactured using CNC mills with tools as fine as 0.5 mm.
